Join the BIND 4.0 SME Connection Initiative to Solve Real Industry Challenges - fundsforNGOs

Participations are now open for the 2nd Edition of the BIND 4.0 SME Connection Initiative to Solve Real Industry Challenges.

Donor Name: Basque Open Innovation Platform (BIND 4.0)

Country: Global

Type of Grant: Initiative

Deadline: 02/03/2023

Details:

Through the BIND 4.0 SME Connection, innovative Startups discover current industry challenges and get immersed in the cooperative Basque Entrepreneurial and Innovation Ecosystem through Open Innovation. Participating Startups earn reputable reference customers while working on paid contracts implementing solutions in real environments for one or more leading local companies.

Currently approaching its second edition, this public-private initiative, led by industry Cluster Management Organisations (CMO) in the Basque Country, aims to connect them with exciting Startup teams, to provide specialized solutions for their open innovation, digital transformation needs.

The driving force behind the SME Connection initiative is to make the most of the connections and expertise gained from six editions of success of the BIND 4.0 Open Innovation Platform, in order to generate new collaborative opportunities between Basque SMEs and Startup teams worldwide, following the model of Cluster-led Challenges.

Sector-led Challenges for Industry 4.0

Through the Dynamic Industry Cluster Organizations of the Basque Country, the members of the BIND 4.0 SME Connection identify a series of common challenges that directly affect their businesses. The goal is to respond to these challenges through the development of innovative projects in collaboration with technology startups. Once the startups’ applications have been submitted, the SMEs can select the solutions presented that best fit their demand, depending on the challenges posed. In some cases, more than one startup may be selected for the same challenge.
The SMEs that form the BIND 4.0 SME Connection are active members of different Basque Clusters and leaders of reference in their sector. This year, 28 SMEs are looking for innovative solutions to respond to the new challenges faced by the industry in its digital transformation process, through the application and development of disruptive technologies.
- Environment Cluster
  - Challenge One: Optimization of the capture and management of data extracted by third-party sensors.
    - Entity posing the challenge ACLIMA: Agrupalab, AAC-Acústica, Sercontrol
    - Possible solutions that can be applied:
      - Sensor-related services -Internet of Things: design of networks and/or printed circuit boards, improvement of consumption and wireless communications, middleware etc.
      - IoT management platforms for storing, analysing and visualising data obtained from monitoring equipment.
  - Challenge Two: Laboratory Data modeling for cause-effect pattern generation.
    - Entity posing the challenge ACLIMA: Agrupalab, AAC-Acústica, Sercontrol
    - Possible solutions that can be applied:
      - Big data and AI
      - Sensors applied to environmental monitoring
- Business Association
  - Challenge One: Improvement of Industrial Machinery data extraction and monitoring.
    - Entity posing the challenge ADEGI: Couth Industrial Marking Systems, Salva Industrial, Korta, Metrología Sariki, Comercial Hostelera Del Norte Equipamientos, Euskabea Electrónica del Urumea
    - Possible solutions that can be applied:
      - Sensors and IoT platforms
      - Storing and structuring data on big data platforms
      - Technologies for carrying out structural analyses/physical interpretations of machines/components
  - Challenge Two: Intelligent data management for machine and component servitisation
    - Entity posing the challenge ACLIMA: Agrupalab, AAC-Acústica, Sercontrol
    - Possible solutions that can be applied:
      - Big data and AI
      - Sensors applied to environmental monitoring
- Food & Beverage
  - Challenge One: Intelligent demand forecasting and improvement of procurement and stocking processes
    - Entity posing the challenge BASQUE FOOD CLUSTER: Artomaña Txakolina, Bodegas Itsasmendi, Cafés Baqué, Paturpat, Giraldo Food Group
    - Possible solutions that can be applied:
      - Artificial intelligence: demand forecasting algorithms.
      - Logistics control tower / logistics dashboard.
      - Other Track & Trace technologies or logistics traceability.
  - Challenge Two: Product and machinery traceability in and outside the factory.
    - Entity posing the challenge ACLIMA: Agrupalab, AAC-Acústica, Sercontrol
    - Possible solutions that can be applied:
      - Big data and AI
      - Sensors applied to environmental monitoring
- Construction Cluster
  - Challenge One: Construction site process data capture and análisis
    - Entity posing the challenge ERAIKUNE: Fhimasa, Fulcrum, Repair, Obras Especiales, Zikotz
    - Possible solutions that can be applied:
      - Software for managing work, consolidating and managing information.
      - AI for exploiting and analysing data.
      - Other techniques for data capture and exploitation: OCR, NLP, etc.
  - Challenge Two: Infrastructure maintenance and management through Digital Twin
    - Entity posing the challenge ERAIKUNE: Fhimasa, Fulcrum, Repair, Obras Especiales, Zikotz
    - Possible solutions that can be applied:
      - Data visualisation technologies: Virtual reality (VR) and digital twin
      - Adding sensors to infrastructure
- Equipment, Furniture & Design
  - Challenge One: Securisation of Smart devices and connections
    - Entity posing the challenge HABIC: ALCAD, BURDINOLA, DAISALUX, OJMAR
    - Possible solutions that can be applied:
      - Cybersecurity: securing assets and cyber-intelligence
      - Software and hardware security engineering
      - Managing security and threat intelligence
- Advanced Manufacturing
  - Challenge One: Machine health and productive processes optimization through AI
    - Entity posing the challenge UPTEK: IBARMIA, LANTEK, LOIRE, ONA, ZAYER
    - Possible solutions that can be applied:
      - Fingerprint (machine fingerprint)
      - Digital twin of the machine
      - Machine learning: pattern analysis and smart prediction of failures in critical elements
      - Data Intelligence / Intelligent automation
  - Challenge Two: Machine data securisation and global asset hardening
    - Entity posing the challenge UPTEK: IBARMIA, LANTEK, LOIRE, ONA, ZAYER
    - Possible solutions that can be applied:
      - Cybersecurity: securing assets/data and cyber-intelligence
      - Software and hardware security engineering
      - Security management and threat intelligence: monitoring and correlating threats
      - Audits and risk mapping
      - Technologies for strengthening remote access
      - Digital identity and access management (IAM)

Startup Benefits

Real Projects with Real Turnover
Facilitated Access to Market
Rapid Implementation of Solutions
Reputable Reference Customer
Positioning and Visibility
Maintain Technology Ownership
BIND 4.0 Proven Success Model
Join the Basque Entrepreneurial Ecosystem
Startups benefit from the active participation of technological SME companies seeking targeted solutions to joint challenges created by the SMEs with the Cluster Management Organisation in BIND 4.0 SME Connection.

What type of Startups should apply?

Startups developing new technologies for the industrial sector and its related services, which have already completed their technological development. In other words, startups that have a product or solution that can be seen, tested, proven, or even already available on the market.
Startups that are no more than 8 years old, that present the use of new technologies to improve industrial processes and that are ready to accelerate their business development.
Startups with disruptive solutions that can be applied to the Energy, Advanced Manufacturing, Environmental and Automotive industries, including:
- Artificial Intelligence, Big Data Analytics, Computing, Cybersecurity, Artificial Vision, IoT, 3D Printing – Additive Manufacturing, Collaborative Robotics, Nanotechnology, New Material, AR/VR and so much more!

For more information, visit BIND 4.0.

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