This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging through investments in five (5) R&D Areas: (1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA).
Donor Name: National Institute of Standards and Technology
State: All States
County: All Counties
Type of Grant: Grant
Deadline:Â 12/20/2024
Size of the Grant: More than $1 million
Grant Duration: 5 Years
Details:
Within the CHIPS for America program, the mission of the National Institute of Standards and Technology’s (NIST) CHIPS Research and Development Office (CHIPS R&D) is to accelerate the development and commercial deployment of foundational semiconductor technologies by establishing, connecting, and providing access to domestic research efforts, tools, resources, workers, and facilities. CHIPS R&D aims to achieve the following goals by 2030:
- U.S. Technology Leadership: The United States improves its capacity to invent, develop, prototype, manufacture, and deploy the foundational semiconductor technologies of the future.
- Accelerated Ideas to Market: The best ideas achieve commercial scale as quickly and cost effectively as possible.
- Robust Semiconductor Workforce: Inventors, designers, researchers, developers, engineers, technicians, and staff sustainably meet evolving domestic government and commercial sector needs.
The NAPMP seeks to drive U.S. leadership in advanced packaging and provide the technology and skilled workforce needed for packaging manufacturing in the United States. Coupled with CHIPS manufacturing incentives, NAPMP-funded objectives will establish a vibrant, self-sustaining, profitable, domestic advanced packaging industry where advanced-node chips manufactured in the United States and abroad can be packaged in appropriate volumes within the United States and innovative designs and architectures are enabled through leading-edge packaging capabilities. In combination with other CHIPS for America education and workforce efforts, NAPMP-funded activities will produce the diverse and capable workforce needed for the success of the domestic packaging sector.
NAPMP Advanced Packaging R&D NOFO Objectives
The objective of this NOFO is to enable, through R&D, innovative new advanced packaging flows suitable for adoption by U.S. industry. To pursue this objective, CHIPS R&D designed the NOFO with the following elements.
- First, the NOFO sets out, across multiple R&D areas, key challenges and technology gaps in advanced packaging which must be addressed.
- Second, it provides for coordinated R&D efforts aligned through common technical targets so that results collectively contribute to composable and implementable advanced packaging flows.
- Finally, it provides for demonstrating the benefits of R&D results through a combination of prototypes and baseline packaging flows.
Funding Information
For the Equipment, Tools, Processes, and Process Integration R&D area, CHIPS R&D anticipates making available up to approximately $450,000,000 for funding multiple awards in amounts ranging from approximately $10,000,000 to approximately $150,000,000 in Federal funds per award, with a five (5) year period of performance per award.
- Equipment, Tools, Processes, and Process Integration
- Total Funding: $450M
- Anticipated Maximum Award: $150M
- Power Delivery and Thermal Management
- Total Funding: $250M
- Anticipated Maximum Award: $50M
- Connector Technology, Including Photonics and Radio Frequency (RF)
- Total Funding: $250M
- Anticipated Maximum Award: $100M
- Chiplets Ecosystem
- Total Funding: $300M
- Anticipated Maximum Award: $75M
- Co-design/Electronic Design Automation (EDA)
- Total Funding: $250M
- Anticipated Maximum Award: $100M.
Project ActivitiesÂ
- Project activities are expected to include, but not necessarily be limited to, all of the following: basic and applied research; systems, equipment, tools, and software systems development and production as appropriate to the R&D area; commercial viability analyses and domestic production preparation; integrated education and workforce development; and prototype production.
- CHIPS R&D expects that applicants assembling teams (i.e., an applicant from industry or academia working with one or more eligible subrecipients) may be best suited to collectively provide the full range of expertise and capabilities needed to achieve the program objectives and to successfully strengthen U.S. advanced packaging innovation. Equally important, effective partnerships can promote inventiveness, clarify future demand, improve transparency and security, solidify business and domestic manufacturing plans (including plans for technology adoption by defense and commercial partners), develop environmentally sustainable manufacturing solutions, help educate the future workforce, mitigate the risk of future chip shortages or oversupply, and support a more productive, efficient, and self-sustaining semiconductor ecosystem.
- CHIPS R&D therefore strongly encourages proposals from teams that demonstrate collaboration across the innovation, manufacturing, supply chain, and customer landscape, as well as across the industry, non-profit, and academic sectors.
Eligibility CriteriaÂ
Eligible applicants are domestic non-profit organizations; domestic accredited institutions of higher education; State, local, and Tribal governments; and domestic for-profit organizations. A domestic entity is one that is incorporated within the United States (including a U.S. territory) with its principal place of business in the United States (including a U.S. territory).
For more information, visit Grants.gov.
